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SAC0307-PN436T-LEAD FREE SOLDER PASTE

08/09/2018 - 17:05:03 | webadmin
SAC0307-PN436T LEAD FREE SOLDER PASTE

HiQ® SAC0307-PN436T is Sn/Ag/Cu lead free and halide free solder paste design to provide extremely
broad process windows for printing, wetting and pin-probe test. HiQ® PN436T unique flux chemistry
system provides superior solderability as compared to conventional tin-lead solder paste system.
PN436T technology offering the paste to meet the thermal requirements of most of alloys for examples
Sn/Ag/Cu alloys (high silver content SAC305 or low silver content SAC0307, SAC105...). PN436T also
performs excellent cosmetic appearance in the reflowed solder joints with shiny, smooth and clear residues.
PN436T Flux Designator ROL0, no clean and halide free standard under IPC ANSI/J-STD-004A Joint Industry Standard

Download datasheet HERE for detail information

 

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SAC0307-PN436T-LEAD FREE SOLDER PASTE, solder paste

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